Any device has a certain loss when it is working, and most of the loss becomes heat. Low-power devices have relatively small losses and do not require heat dissipation devices. High-power devices have large losses. If heat dissipation measures are not taken, the temperature of the die can reach or exceed the allowable junction temperature, and the device will be damaged. Therefore, it is necessary to add a heat sink. The most commonly used is to install the power device on the radiator, use the radiator to dissipate the heat to the surrounding space, and add a cooling fan when necessary to enhance the cooling and heat dissipation at a certain wind speed. Flow cold water cooling plates are also used on the power devices of some large-scale equipment, which have better heat dissipation effects. Heat dissipation calculation is to determine suitable heat dissipation measures and heat sinks through calculations under certain working conditions. The power device is installed on the heat sink. Its main heat flow direction is from the die to the bottom of the device, and the heat is dissipated to the surrounding space through the heat sink.

Small electronic radiators (or heat sinks) are made of aluminum alloy sheet through stamping process and surface treatment, while large electronic radiators are made of aluminum alloy extruded into profiles, and then made by machining and surface treatment. They have various shapes and sizes for different device installations and devices with different power consumption. The radiator is generally a standard part, but profiles can also be provided, which can be cut into a certain length by the user to make a non-standard radiator. The surface treatment of the radiator includes electrophoretic paint or black oxygen polarization treatment, the purpose of which is to improve heat dissipation efficiency and insulation performance.

Electronic radiators are usually heat sinks for heat dissipation of high-power electronic components. There is no external power supply and natural cooling. Most of them are made of aluminum alloy profiles and cut to the required size according to the size of the components, such as high-power switch tubes or triodes. The heat sink. Of course, under special circumstances, ultra-high-power electronic components also have cooling fans. For example, the switch tube of a switching power supply must be equipped with a cooling fan.