The big reason for the heat dissipation capacity of the LED heat sink is related to the LED heat dissipation technology it uses. The LED heat dissipation technology was born in 2000 and is made of semiconductor light-emitting diodes. Its working principle is to generate electroluminescence by radiation compound, and use aluminum heat sink fins as part of the shell to increase the heat dissipation area.

Like traditional light sources, semiconductor light-emitting diodes (LEDs) also generate heat during operation, the amount of which depends on the overall luminous efficiency. Under the action of external electric energy, the radiation of electrons and holes recombine to produce electroluminescence. The light radiated near the PN junction also needs to pass through the semiconductor medium and packaging medium of the chip itself to reach the outside (air). Combining current injection efficiency, radioluminescence quantum efficiency, and chip external light extraction efficiency, in the end, only about 30-40% of the input electric energy is converted into light energy, and the remaining 60-70% of the energy is mainly caused by non-radiative recombination of lattice vibration Form transforms heat energy.

The relationship between LED radiator chip size and heat dissipation

The most direct way to increase the brightness of a power LED is to increase the input power, and in order to prevent the saturation of the active layer, the size of the p-n junction must be correspondingly increased; increasing the input power will inevitably increase the junction temperature and reduce the quantum efficiency. The increase in the power of a single tube depends on the ability of the device to extract heat from the pn junction, while maintaining the existing chip material, structure, packaging process, current density on the chip, and equivalent heat dissipation conditions, the size of the chip and the junction area are increased separately The temperature will continue to rise.

The size of LED chips can be divided into low-power chips, medium-power chips and high-power chips according to power. According to customer requirements, it can be divided into single tube level, digital level, dot matrix level and decorative lighting. As for the specific size of the chip, it is determined according to the actual production level of different chip manufacturers, and there is no specific requirement. As long as the process is passed, the small chip can increase the unit output and reduce the cost, and the photoelectric performance will not change fundamentally. Dongguan Zhigao Industrial Co., Ltd. specializes in processing automotive power amplifier aluminum radiators, household power amplifier radiators and LED lights. The main body of heat dissipation can be a good manufacturer of your choice of LED heat sink.

The current used by the chip is actually related to the current density flowing through the chip. A small chip uses a small current, and a large chip uses a large current. Their unit current density is basically the same. If the current used by the 10mil chip is 20mA, the theoretical current used by the 40mil chip can be increased by 16 times, which is 320mA. But considering that heat dissipation is the main problem under high current, its luminous efficiency is lower than that of small current. On the other hand, as the area increases, the body resistance of the chip will decrease, so the forward conduction voltage will decrease. From these perspectives, the chip size of the LED heat sink will affect the heat dissipation.