1. In the case of ensuring that the actual junction temperature of the semiconductor power device is less than the maximum junction temperature during operation, a small size and light weight specification should be selected as much as possible.

　　 2. The effect of the heat sink is closely related to the installation process. During installation, the contact area between the power device and the heat sink should be increased as much as possible to reduce the contact thermal resistance and improve the heat transfer effect.

　　3. If the contact thermal resistance is lowered smaller, a thin thermal grease is added between the power device and the heat sink during installation, which can reduce the thermal resistance by 25-30%.

　　 4. It is necessary to pad a thermal or insulating gasket between the device and the radiator during installation. It is recommended to use low thermal resistance materials, such as copper platinum, aluminum platinum or thin mica, polyester film.

　　 5. When installing a device, its mounting hole (or group hole) is placed at the center (L/2) position of the base surface of the heat sink. When two or more devices are installed, their mounting holes (or group holes) are evenly distributed (L/2n) on the center line of the base surface of the radiator.

　　 6. When tightening devices, ensure that the screw torque is consistent.

　　7. After the power device and the heat sink are installed, it is not advisable to mechanically process or reshape the power device and the heat sink, otherwise stress will be generated and the contact thermal resistance will increase.

　　 8. Single-sided finned radiator, suitable for natural air cooling outside the equipment (such as installed outside the chassis), which is beneficial to the ventilation and heat dissipation of power devices and reduces the temperature rise inside the machine.

　　 9. After natural cooling, the section of the radiator should be parallel to the horizontal plane: when forced air cooling, the direction of airflow should be parallel to the direction of the fins of the radiator.